酚类改性氰酸酯树脂体系介电性研究  

Study on dielectric performance of phenol modified cyanate ester resin

作　　者：洪义强[1] 钟翔屿[2] 包建文[2] 付中玉[1] 

机构地区：[1]北京服装学院,北京100029 [2]北京航空材料研究院,北京100095

出　　处：《热固性树脂》2006年第4期14-17,共4页Thermosetting Resin

摘　　要：采用DSC和红外等方法研究了酚对氰酸酯树脂固化反应的影响，以及不同酚含量的氰酸酯树脂体系及其复合材料在常温、高温、宽频（7-18GHz）等条件下介电常数及介电损耗。结果表明，酚的加入可以显著促进氰酸酯树脂的固化反应；适量酚的加入能显著提高氰酸酯树脂体系的介电性但是会降低其玻璃化转变温度；含有壬基酚的氰酸酯树脂体系复合材料在宽频下表现出稳定的介电性。The effect of phenol on curing reaction of cyanate ester through DSC and FTIR and the dielectric constant and loss of cyanate ester resin of the different concentration of nonylphenol in normal, high temperature and broad frequencies（7- 18 GHz） was studied and test showed that it could be accelerated by phenol and the dielectric performance of cyanate ester could be remarkably improved by nonylphenol while the tg fall and the dielectric performance in broad frequencies showed stabilization.

关 键 词：氰酸酯树脂 介电常数 介电损耗 

分 类 号：TQ323[化学工程—合成树脂塑料工业]