激光微加工技术在集成电路制造中的应用  

Research Progress of Laser Micro Processing in Integrated Circuits Manufacturing

作　　者：曹宇[1] 李祥友[1] 蔡志祥[1] 曾晓雁[1] 

机构地区：[1]华中科技大学激光加工国家工程研究中心,武汉430074

出　　处：《光学与光电技术》2006年第4期25-28,共4页Optics & Optoelectronic Technology

基　　金：国家自然科学基金(50575086);国家863新材料主题(2005AA311030)资助项目

摘　　要：激光微加工技术以非接触加工方式,高效率、无污染、高精度、热影响区小的优点在微电子集成电路制造中得到了广泛应用。介绍了在集成电路制造封装中采用的激光微调、激光打孔、激光清洗、激光柔性布线和激光微焊技术。Laser micro processing is widely used in micro-electronics integrated circuit manufacturing based on its several excellent features such as high-efficiency, high-precision, clean and flexible processing, etc. Research progresses of laser trimming, laser drilling, laser cleaning, laser flexible routing and laser micro welding applied in the IC fabrication and packaging are given.

关 键 词：激光微加工 集成电路制造 激光微调 激光清洗 激光打孔 激光柔性布线 激光微焊 

分 类 号：TN249[电子电信—物理电子学]