低温下固体表面接触热阻的研究  

The Research of Contact Thermal Resistance of Solid Surface at Low Temperature

作　　者：徐烈[1] 杨军[1] 徐佳梅[1] 周淑亮[1] 胡江武[1] 张存泉[1] 唐应堂 

机构地区：[1]上海交通大学低温研究和测试中心,上海桑菱环境能源研究所

出　　处：《低温与超导》1996年第1期53-58,共6页Cryogenics and Superconductivity

基　　金："八六三"基金

摘　　要：该文根据“８６３“基金项目的要求，对影响固体表面接触热阻的因素进行了分析，着重研究了固体表面的形貌以及接触压力与界面温度等对其接触热阻的影响，并通过实验给出了几组已知材料的接触热阻值，为工程设计提供了有用的资料．At the request of '863' projects,the factors which affect the contact thermal resistance of solid surfacte are anslyzed in the paper.The shape of solid surface,the contact pressure and temperature of the contact surface were intensively studied in order to admire thieir effect on consistance.Also through experiment the data of contact thermal resistace of some known materials are presented.Which can be helpful to engineering design.

关 键 词：接触热阻 固体表面 低温 

分 类 号：O513[理学—低温物理]