片式压电陶瓷谐振器的研制  

The Manufacture of Chip's Piezoelectricity Ceramic Resonator

作　　者：范坤泰[1] 朱传琴[2] 张录周 杨志坚[1] 孙兆海 

机构地区：[1]山东大学信息科学与工程学院,山东济南250061 [2]山东电力高等专科学校,山东济南250002 [3]山东沂光电子公司,山东临沂276003 [4]淄博宇海电子陶瓷有限公司,山东淄博255202

出　　处：《压电与声光》2006年第4期423-425,共3页Piezoelectrics & Acoustooptics

摘　　要：世界组装技术的新发展,要求元器件片式化,本课题就是研制片式压电陶瓷谐振器。是在插脚式配方的基础上,用Mg、Ca等离子取代Pb,并掺入Ce、Mn等杂质,以提高居里温度。采用气流粉碎法、热压烧结、厚度切变模及叠层封装结构,以利于稳定性和片式化。最终研制出频率精度高、温度特性好的片式压电陶瓷谐振器。In the world, the tendency of assembling technology today is to make devices chipped, the paper is about the development of chip＇s piezoelectricity ceramic resonators. Basing on the formula of leg＇s piezoelectricity ceramic resonators, we add impurities of Ce,Mn and etc. and substitute Mg^2＋ , Ca^2＋ for Pb^2＋. In order to raise the devices＇ curie temperatures , moreover, we also use airflow smashing method, sintering under pressure, thickness cut changed vibration mode and encapsulation of laminated construction, which is beneficial to increase the stability and to make the devices chipped. The testing results indicate that these chipped devices have high frequency precision and good temperature property.

关 键 词：片式压电陶瓷谐振器 锆钛比(Zr/Ti) 复合掺杂 热压成形 

分 类 号：TN282[电子电信—物理电子学]