Bi-2223带材有阻焊接接头电阻特性的研究  

STUDY ON JOINT PROPERTIES OF Bi-2223/Ag TAPE

作　　者：张宏杰[1] 宗军 王素丽 励庆孚[1] 

机构地区：[1]西安交通大学电气工程学院,西安710049 [2]北京英纳超导技术有限公司,北京100176

出　　处：《低温物理学报》2006年第3期275-279,共5页Low Temperature Physical Letters

基　　金：西安交通大学博士学位论文基金(DFxjtu2002-8)资助的课题~~

摘　　要：本文针对Bi-2223/Ag带材接头有阻焊接展开研究,考虑大电流时超导I^V特性非线性影响,建立焊接接头电阻特性的有限元计算模型,总结出不同搭接距离和焊锡层厚度对接头电阻的影响规律,并着重分析了接头电阻对临界电流的影响,最终通过实验验证了理论分析得到的一些基本规律.为降低Bi-2223/Ag带材接头电阻对高温超导磁体运行时的不利影响,实际焊接时搭接距离应保证在7~10cm以上.Long lengths of BSCCO-2223/Ag tape with shorter lengths. In some commercial application, high performance are more difficult to fabricate than different superconducting components must be jointed. Jointing technique must be reliable and efficient electrical. Splicing of Bi-2223/Ag tape by soldering should be performed in a way leaving the splice with electrical properties just as good compared with unspliced tape. This paper studies on the factors influencing the resistance in the joint. The finite element method was used to calculate the joint resistance and the critical current of the joint. The criterion to decrease the soldering resistance are summed up and the results are confirmed by experiments.

关 键 词：BI-2223/AG带材 焊接 接头电阻 

分 类 号：TG407[金属学及工艺—焊接]