环氧灌封料低温开裂问题及对策研究进展  

Progress in Study on Crack Initiation in Epoxy Resin Sealing Compounds at Low Temperature and its Measures

作　　者：李芝华[1] 谢科予[1] 

机构地区：[1]中南大学材料科学与工程学院,长沙410083

出　　处：《材料导报》2006年第8期41-43,47,共4页Materials Reports

基　　金：军工民口配套项目"抗低温开裂F级环氧树脂灌封料"(MKPT04388)

摘　　要：针对如何解决环氧树脂灌封料在低温下易产生开裂这一问题进行了探讨。简要分析了环氧树脂灌封料产生开裂的原因;着重从配方设计方面介绍了目前通过对环氧树脂、固化剂、增韧剂和填料的选择来提高环氧灌封料抗低温开裂性能的研究应用进展;同时,从产品结构设计、灌封工艺方面对如何改善环氧灌封料的抗低温开裂性能提出了一系列对策。The problem of crack initiation in epoxy resin sealing compounds at low temperature is discussed in this paper. The reasons of the crack initiation are analyzed. The research development about the process and the methods to improve the crack-resistant of the epoxy resin sealing compounds by choosing suitable epoxy resin, curing agent,toughening agent and filler are also introduced in detail. Meanwhile, a series of methods are proposed to improve the crack-resistant attributes by optimizing the techniques about structure design and sealing of product.

关 键 词：环氧树脂 灌封 开裂 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]