电铸nano-Al_2O_3/Cu复合材料的组织与性能  

Microstructure and property of electroformed nano-Al_2O_3/Cu composite

作　　者：朱建华[1] 刘磊[1] 赵海军[1] 沈彬[1] 胡文彬[1] 

机构地区：[1]上海交通大学金属基复合材料国家重点实验室,上海200030

出　　处：《复合材料学报》2006年第4期65-71,共7页Acta Materiae Compositae Sinica

基　　金：国家自然科学基金(50401004);国家高科技研究发展计划(2002AA334010);上海市科委重点新材料重点项目(035211037)

摘　　要：采用复合电铸工艺,在硫酸铜镀液中加入纳米氧化铝颗粒制备了纳米颗粒弥散增强铜基复合材料,利用扫描电镜、电子透镜对复合材料的表面、拉伸断面和摩擦磨损表面的形貌以及微观组织进行了观察,并对显微硬度、拉伸性能、磨损性能及电阻率进行了研究。结果显示,氧化铝颗粒及其团聚体以纳米级尺寸弥散分布在铜基体中,且与铜基体结合良好。复合材料的硬度最大增幅达42%。氧化铝颗粒含量在1.26%时,复合材料的拉伸强度和延伸率分别高达385 MPa、26%。相对电铸纯铜,复合材料的耐磨性能明显提高,而复合材料的电阻率最大增幅小于6%。The composite electroforming technology was employed to fabricate nano-sized alumina particles （nano- Al2O3） reinforced copper composite in copper sulfate sulfuric acid plating solution. The surface, fracture and wear surface morphologies were observed by scanning electron microscopy （SEM）, and the microstructure was observed by transmission electron microscopy （TEM）. Microhardness, tensile property, wear resistance and electrical resistivity （Er） were examined. The results show that Al2O3 particles and their agglomerations with nano size disperse in the copper matrix and have good bonding with copper matrix. The microhardness of composite can be 42% higher than that of electroformed pure copper. The tensile strength and the extensibility reach 385 MPa and 26 %, respectively, as the nano-Al2O3 mass fraction is 1.26 %. Wear resistance of composite is enhanced obviously. Compared with electroformed pure copper, the increase amplitude in electrical resistivity of the composite is below 6 %.

关 键 词：复合电铸 纳米氧化铝颗粒 铜基复合材料 微观组织 性能 

分 类 号：TQ153[化学工程—电化学工业]