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机构地区:[1]辽宁工程技术大学材料科学与工程系,阜新123000
出 处:《复合材料学报》2006年第4期78-82,共5页Acta Materiae Compositae Sinica
基 金:辽宁省教育厅高等学校科学研究基金(990621074)
摘 要:采用电磁离心铸造(EMCC)工艺制备SiCP/Al复合材料,实验了两种不同粒度的SiCP颗粒增强Al基体,测定了不同励磁电压下颗粒在基体中的分布,测试了不同粒度增强基体均匀分布的材料的硬度和耐磨性。结果发现电磁搅拌更容易使小粒度的颗粒分布均匀。励磁电压为100 V时的颗粒分布比励磁电压为50 V时的颗粒分布更均匀。均匀分布的小颗粒增强基体的复合材料的硬度和耐磨性有很大提高。The Al matrix composite material reinforced by SiC particle of different sizes was prepared by electromagnetic centrifugal casting (EMCC). The different size particle distribution affected by different exciting voltages was studied. The hardness and abrasion resistance of different size particle reinforced composite were also studied. The results show that it is much easier for the smaller particles to scatter evenly with the same exciting voltage by electromagnetic stirring (EMS). The same size particles distribute more evenly with 100 V exciting voltage than with 50 V exciting voltage. The hardness and abrasion resistance of the composite are improved greatly by the more even distribution of smaller particles.
分 类 号:TB331[一般工业技术—材料科学与工程] TG249.4[金属学及工艺—铸造]
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