镁合金化学镀镍层孔隙率的影响因素  

The deposition process of electroless nickel plating on magnesium alloy

作　　者：邵忠财[1] 田彦文[2] 李建中[2] 张红杰[1] 张弘[1] 

机构地区：[1]沈阳理工大学环境与化学工程学院,沈阳110168 [2]东北大学材料与冶金学院,沈阳110004

出　　处：《材料研究学报》2006年第4期403-406,共4页Chinese Journal of Materials Research

基　　金：辽宁省自然科学基金No.2040189资助项目.~~

摘　　要：根据基体元素与相应的指示剂显色原理,采用贴试纸法,测定了镁合金化学镀层的孔隙率,研究了镀液参数对孔隙率的影响．结果表明,采用铬黑T作指示剂溶液测定镁合金化学镀层孔隙率的效果最佳,镁试剂Ⅰ效果次之,茜素磺酸钠指示剂最差;络合剂、缓冲剂、氟化物和稳定剂等镀液参数对化学镀层孔隙率的影响趋势为:先减小,后增加．采用贴试纸法测定化学镀层孔隙率是可行的．According to a color reaction between the element of the substrate and indicators, the coating porosity was evaluated by filter paper method. The effect of the plating parameters on the coating porosity was investigated. The results show that the eriothrome black T indicator used as an indicator of the coating porosity for coatings on magnesium alloy is more effective than magneson indicator and sodium alizarinesulfonate indicator. An affecting trend of the plating bath parameters on the coating porosity was obtained. For the effect of ligands, buffer agents, fluoride and stabilizer, the porosity decreases with increase of the concentration, and then increases gradually. The filter paper method was a practicable way of evaluating the porosity in electroless nickel deposits on magnesium alloy.

关 键 词：镁合金 化学镀镍 孔隙率 耐蚀性 

分 类 号：TQ153.1[化学工程—电化学工业]