先进电子封装技术与材料  

Advanced Electronic Encapsulating Technology and Materials

作　　者：黄文迎[1,2] 周洪涛 

机构地区：[1]北京波米科技有限公司 [2]清华大学信息技术研究院电子封装技术研究中心,北京100084 [3]北京科化新技术科技有限公司

出　　处：《精细与专用化学品》2006年第16期1-5,共5页Fine and Specialty Chemicals

摘　　要：概述了目前主要的先进电子封装技术及发展趋势、电子封装材料的发展历程以及随着先进的封装形式和技术的不断更新,封装材料的发展方向;重点阐述了环氧塑封料的性能、性能与组分间的关系、改进方法以及发展趋势;简述了先进封装用的液体环氧封装材料、聚酰亚胺材料等研究情况。The main advanced electronic encapsulating technology, its development trend, the development course of electronic encapsulating material and its heading direction along with the continual update of methods and technology were summarized. The performance of epoxy molding compound, its relationship between the property and component, modification methods and its development trends were narrated in detail. The research status of advanced electronic materials such as liquid epoxy molding compounds and polyimide used in encapsulation were briefed.

关 键 词：电子封装技术 电子封装材料 环氧塑封料 环氧树脂 聚酰亚胺 

分 类 号：TN305.94[电子电信—物理电子学]