用于红外单光子探测的APD二次封装技术  

APD Post-packaging Technology for Single-photon Detection in Infrared Region

作　　者：李日豪[1] 廖常俊[1] 王金东[1] 郭健平[1] 刘颂豪[1] 

机构地区：[1]华南师范大学信息光电子科技学院,广东广州510631

出　　处：《半导体光电》2006年第4期376-378,382,共4页Semiconductor Optoelectronics

基　　金：国家"973"计划项目(G2001039302);广东省科技专项项目(2003A103405);广州市重大科技攻关项目(2001-Z-095-01)

摘　　要：介绍了用于红外光探测的APD二次封装的概念和技术,将绝热和致冷分开考虑和设计,在常温常压下进行填充式清洁干燥气密封装,保持真空密封的优点,消除潮气的影响,致冷效率高。封装后的外形小巧,结构简单规范,与电控及信号处理系统适配,性能测试结果良好。The concept and technology of post-packaging are introduced to improve the cooling efficiency in avalanche photodiode （APD） thermally controlled for single-photon detection in infrared region. The thermal insulating,abstracting and the air hermetic sealing are considered separately in designing. The clean, dry and hermetic packaging is realized at normal temperature and pressure. The device can keep up the merit of vacuum encapsulation, eliminate the humidity influence,and has high efficiency. In addition, the device is characterized by small figure,simple configuration, matching with the electricity control and signal process system, and good performances.

关 键 词：单光子探测 二次封装 半导体珀尔帖致冷 

分 类 号：TB66[一般工业技术—制冷工程]