掺杂石墨与铜钎焊的显微组织  

The Microstructure of Brazed Joint of Doped Graphite and Copper

作　　者：钟志宏[1] 周张健[1] 宋书香[1] 都娟[1] 葛昌纯[1] 

机构地区：[1]北京科技大学粉末冶金特种陶瓷研究中心,北京100083

出　　处：《稀有金属材料与工程》2006年第A02期117-120,共4页Rare Metal Materials and Engineering

摘　　要：通过SEM、EDS、EPMA及XRD等手段研究了掺杂石墨与铜钎焊的显微组织。结果表明:用非晶态Ti-Zr-Cu-Ni钎料在不加中间层及插入Mo／Cu复合中间层的情况下,掺杂石墨和铜均能够很好地被连接在一起,接头未发现明显的气孔、裂纹及未焊合的区域;钎料中的活性元素Ti向掺杂石墨一侧扩散,使得掺杂石墨与钎料之间形成冶金连接,其主要因素是形成了碳化物:钎料／铜界面处主要生成了金属间化合物,而钎料／石墨界面除了金属间化合物的存在外,还发现有碳化物的存在:钎缝组织内部由金属间化合物组成。The microstructure of brazed joint doped of graphite and copper were studied by SEM, EDS and X-ray diffraction in this paper. The results show that doped graphite can be joined to copper well with no interlayer or inset Mo/Cu composite interlayer by using amorphous Ti-Zr-Cu-Ni filler metal; Pore, crack and badly brazed region were not found in the joints; Active metal Ti in the brazing alloy diffused to graphite side and carbide was formed by reaction, which is the main reason to make the graphite join well to brazing alloy; The interface of filler metal/copper mainly consisted of inter-metallic compound; Other than inter-metallic compound was found, carbide also found in the filler metal/copper interface. Inside of the brazed seam mainly consisted of inter-metallic compound.

关 键 词：非晶态Ti-Zr-Cu-Ni 掺杂石墨 铜 钎焊组织 

分 类 号：TG454[金属学及工艺—焊接]