片状铜粉化学镀锡的工艺研究  

A Study on Process of Electroless Tin Plating on Flake Copper Powder

作　　者：陈步明[1] 郭忠诚[1] 

机构地区：[1]昆明理工大学材料与冶金学院,云南昆明650093

出　　处：《电镀与精饰》2006年第5期8-11,共4页Plating & Finishing

基　　金：国家科技部中小企业创新基金资助(03C26215300708)

摘　　要：采用次磷酸钠作还原剂,在片状铜粉表面化学镀锡,得到片状锡包铜粉。研究了镀液pH、温度、还原剂、稳定剂以及主盐浓度等对锡包铜粉性能的影响规律,研究了锡包铜粉的成分和表面形貌。结果表明:通过控制工艺参数可以获得镀覆质量好,且具有很好导电性和低松装密度的片状锡包铜粉产品。Tin coated flake Cu powder was obtained by electroless tin plating with hypophosphite as reducing agent. The effects of bath temperature, pH value, concentrations of reducing agent, stabilizer and SnCl2, 2H2O morphology and composition of the tin coated Cu flake powder were researched. The results indicate that good coating quality tin coated flake Cu powder with well electric conductivity and loose specific gravity can be obtained by controlling technological parameters.

关 键 词：化学镀 锡包铜粉 镀覆质量 

分 类 号：TQ153.13[化学工程—电化学工业]