耐高低温环氧有机硅胶黏剂的力学性能研究  

Mechanical property of high-and low-temperature resistant epoxy silicone adhesive cured at room temperature

作　　者：李芝华[1] 丑纪能[2] 邓飞跃[2] 

机构地区：[1]中南大学材料科学与工程学院,长沙410083 [2]中南大学化学化工学院,长沙410083

出　　处：《化工新型材料》2006年第8期62-64,共3页New Chemical Materials

基　　金：国家高技术研究发展计划(863计划)探索基金项目(项目编号2003AA84ts04)

摘　　要：介绍了一种研制的室温固化、耐高温、耐低温环氧有机硅胶黏剂。通过对胶黏剂的剪切强度分析,探讨了原料配比,偶联剂等因素对环氧有机硅胶黏剂力学性能的影响。研究表明:增韧剂在胶黏剂中含量适当时(质量比25%),能与固化剂充分反应,有机硅与环氧树脂也能获得较好的相溶性,制备的环氧有机硅胶黏剂的综合性能较优;硅烷偶联剂能改善胶膜界面层的胶接强度,提高环氧有机硅胶黏剂的剪切强度。In this paper, the high-and low-temperature resistant epoxy silicone adhesive cured at room temperature was introduced. The influence of raw material ratio, coupling agent and other factors were discussed by researching shear strength of the adhesive. The results indicated. the properties of epoxy silicone adhesive reach to top as the toughener approaches 25%0, the toughener reacted with the curing agent perfectly, and the epoxy had a good compatibility with silicone. The strength of interracial layer is intensified by the coupling agent which improves mechanical property of the epoxy silicone adhesive.

关 键 词：环氧有机硅 剪切强度 耐高低温 增韧剂 偶联剂 

分 类 号：TQ430.7[化学工程]