激光微技术的发展现状  

Development of Laser Micro Technology

作　　者：陈继民[1] 

机构地区：[1]北京工业大学激光工程研究院,北京100022

出　　处：《激光与光电子学进展》2006年第9期25-29,共5页Laser & Optoelectronics Progress

基　　金：国家自然科学基金项目(编号:50575005);北京市教委项目(编号:KM200510005013)资助

摘　　要：介绍了激光微加工技术的特点,与其它微加工技术相比,激光微加工具有非接触、有选择性加工、热影响区域小、高精度与高重复率等优点,既可以通过去除方式,也可以通过材料堆积进行微加工成型。综述了几种常用的激光微加工技术及其发展趋势,微机电系统(MEMS)技术的进一步成熟,必将带动激光微技术快速发展。Compared with other micro-processing technology, laser micro-mechaning has advantages of non-touching, selective processing, small heat affected zone, high precision, as well as high repitition. Laser micro processing can be applied by either removing material or adding material to fabricate part. Several micro fabrication methods are introduced, such as laser direct writing, selective laser micro-sintering, laser micro-cladding and femtosecond laser micro processing. The prospect of laser micro technology is also referred. We believe these technologies will bring a novel revolution in micro processing field.

关 键 词：激光微技术 去除 加成 微成型 

分 类 号：V261.8[航空宇航科学与技术—航空宇航制造工程]