混合自组装层纳米金修饰电极制备及电化学行为  

The preparation and electrochemical behaviors of binary self-assembled gold nano-particles interface

作　　者：桂学琴[1] 汪海燕[2] 王世君[2] 金葆康[2] 

机构地区：[1]安徽大学现代实验技术中心,安徽合肥230039 [2]安徽大学化学化工学院,安徽合肥230039

出　　处：《安徽大学学报（自然科学版）》2006年第5期69-73,共5页Journal of Anhui University(Natural Science Edition)

基　　金：国家自然科学基金资助项目(20475001);安徽省优秀青年自然科学基金资助项目(06044096);国家人事部留学回国人员启动基金资助项目

摘　　要：利用自组装方法,将两种不同巯基化合物(一种为双巯基化合物)修饰至金电极表面,在双巯基的另一个-SH基团上,吸附纳米金颗粒制备纳米金修饰电极.结果表明该方法可制备纳米金密度可控的修饰电极,该电极具备纳米阵列电极特性.运用电化学方法和扫描电镜,对纳米修饰阵列电极进行研究和表征.改变纳米金周围微环境,可控制修饰电极上电子传递的速度.Mixed self - assembled monolayer was prepared on the surface of gold disk electrode by immersing gold substrate electrode into a mixture in ethanol solution. Gold nanoparticles （NPs） were then adsorbed on MTP molecules through Au - S bond. The density of NP on the interface depends on the amount of MTP adsorbed on gold disk electrode, which can be controlled by altering the ratio of MTP to C18SH in ethanol solution. Scanning electron micrograph （SEM） was used to confirm the density of gold NPs and Fe（CN）6^3-/4- was used as redox indicator to investigate the interface electrochemical behaviors in aqueous solution. It is found each NP particle can be regarded as a nano- electrode and NG/SAM/gold interface act as microelectrode array. The density of NG on the interface shows great influence on electron transfer （ET） and voltammetric behaviors.

关 键 词：纳米金 修饰电极 纳米阵列电极 电子转移 

分 类 号：O648.123[理学—物理化学]