用射流电沉积进行局部快速电镀的工艺研究  

Study of Quick Local Electrodeposition by Jet Plating

作　　者：王梅丰[1] 杜楠[1] 赵晴[1] 卢雄威[1] 

机构地区：[1]南昌航空工业学院材料科学与工程学院,江西南昌330034

出　　处：《材料保护》2006年第9期49-50,70,共3页Materials Protection

摘　　要：射流电沉积是近年来发展起来的一种电沉积新工艺,具有普通电镀所不具备的一些优点。利用二维移动平台系统进行射流电沉积,研究了瓦特镍镀液的喷射速度、温度以及阴阳极间距等因素对射流电沉积的影响。研究结果表明,当镀液喷射速度为0.3m/s,槽电压为20V,阴阳极之间距离为17mm时,采用该系统可在金属试样上快速获得预先设定的图形镀层,镀层分布均匀,与基体的结合力良好。As a new plating process developed in recent years, jet plating is superior to commonly used electroplating processes in some aspects. Thus the jet plating of Watt Ni on a platform movable in 2-dimensions was studied. The effects of jet speed, distance between anode and cathode, bath temperature, and voltage on the jet plaiting were investigated. It was found that the coating with preset patterns could be readily deposited on the metal substrate at a jet speed of 0.3 m/s , bath voltage of 20 V, and distance between anode and cathode of 17 mm. The resulting coating was even and had good adhesion to the metal substrate.

关 键 词：射流电沉积 瓦特镍电镀 局部电镀 

分 类 号：TQ153[化学工程—电化学工业]