高导电镀银玻璃微珠/硅橡胶复合材料的结构与性能  

Structure and performance of high conductibility of silvered glass bead/silicone rubber composites

作　　者：沈玲[1] 邹华[1] 田明[1] 张立群[1] 

机构地区：[1]北京化工大学北京市新型高分子材料制备与成型加工重点实验室,北京100029

出　　处：《合成橡胶工业》2006年第5期375-379,共5页China Synthetic Rubber Industry

摘　　要：探讨了镀银玻璃微珠(SGB)的表面改性、粒径和用量对SGB甲/基乙烯基硅橡胶(VMQ)复合材料的导电性能、力学性能及相态结构的影响,考察了SGB/VMQ复合材料导电网络的影响因素。结果表明,采用硅烷偶联剂改性SGB,可以改善SGB/VMQ复合材料的力学性能和加工性能,其中使用乙烯基三乙酰氧基硅烷(牌号为A-151)还能使其导电性能保持不变。SGB的粒径越大,用量越多,SGB/VMQ复合材料的导电性能越好,当其粒径为41μm、用量300份时,填充的VMQ具有优良的力学性能和导电性能。在满足形成导电通路的前提下,应尽可能地减少SGB的用量,以改善材料的力学性能。The effect of superficial modification, particle size and amount of filler on conductibihy, mechanical properties and morphological structure of silvered glass bead （SGB）/methyl vinyl silicone rubber（VMQ） composites was studied, and the factors of electrical conductive network of SGB/VMQ composites were discussed. The results showed that the mechanical properties of composites were improved by adding coupling agents to the composites, the conductibility of composites was also maintained when vinyhriethoxy silane （A-151） was used especially. The conductibility and mechanical properties of SGB/VMQ composites were good when fillers of SGB were 41 μm and 300 phr. The electrical mechanism of electrical conductive rubber was due to the dispersion of the fillers that could form the conductive paths. Above the threshold of filler loading to form conductive paths, the quantity of fillers added was as little as possible to improve the mechanical properties.

关 键 词：甲基乙烯基硅橡胶 镀银玻璃微珠 硅烷偶联剂 改性 导电性能 相态结构 

分 类 号：TQ333.93[化学工程—橡胶工业]