印制电路板孔金属化相关研究  

Study of Metallization of PCB Holes

作　　者：吴晓华[1] 陈滨[1] 潘军[1] 刘云峰[1] 冯港涛[1] 

机构地区：[1]中南大学冶金科学与工程学院,湖南长沙410083

出　　处：《稀有金属与硬质合金》2006年第3期15-19,共5页Rare Metals and Cemented Carbides

摘　　要：对印制电路板孔金属化所用胶体钯的性质、从废胶体钯溶液中回收金属Pd的工艺方法及染料对酸性镀铜液的均镀能力和深镀能力的影响等进行了研究。结果表明:在回收钯工艺中采用加热破胶法可使金属Pd的回收率达98.79%;添加剂对胶体钯ζ电位有着直接影响,且Na2SnO4和香草醛对胶体钯的稳定性具有一定作用;并对镀层整平性和光亮性以及镀液均镀和深镀能力进行分析比较,确定了实验范围内的最佳染料添加剂是亚甲基蓝和罗丹明B,其均镀能力分别为75.05%和68.42%,深镀能力分别为85%和88%。Study is made of the nature of colloid palladium,the process of recovery of metal Pd from waste colloid palladium solution and also the effect of dye on the covering power and deep-coating power of the acid coppering solution experiment. The results showed that the recovery of palladium metal is up to 98.79% by heating for colloid dissolution. The ￡ potential of colloid palladium is directly affected by the additive,and the colloid stability is affected to some extent by Na2 SnO4 and vanillin. Analysis and comparison is done on the leveling and brightness of the coating as well as the covering power and deep coating power of the coating solution. The best dye for the tests is Methylene blue and Rhodamine B,with covering power 75.05 %, 68.42 % and deep-coating power 85 % and 88 % respectively.

关 键 词：印制电路板 胶体钯 ￡电位 回收金属Pd 酸性镀铜液 添加剂 

分 类 号：TF805.2[冶金工程—有色金属冶金]