脉冲镀和直流镀对钨镀层性能的影响  

Influences of Pulse Plating and DC Plating on the Performance of Tungsten Coating

作　　者：高玉红[1] 李运刚[2] 

机构地区：[1]邯郸学院化学系,河北邯郸056005 [2]河北理工学院冶金系,河北唐山063009

出　　处：《电镀与环保》2006年第5期8-10,共3页Electroplating & Pollution Control

摘　　要：在耐热钢基体上用Na2WO4-ZnO-WO3体系熔盐镀钨,比较了脉冲镀与直流镀对钨镀层性能的影响。在相同镀液配比条件下,脉冲镀可扩大电流密度范围,钨镀层的表面形貌、厚度、结晶度、纯度等都优于直流电镀。The methods to produce tungsten coating on refractory steel from Na2WO4-ZnO-WO3 molten salts are studied. The comparison between the influences of pulse electroplating and DC electroplating on tungsten coating shows that pulse electrodeposition can enlarge the range of current density and is superior to DC plating in the surface morphology, thickness, crystallization and deposition state, purity of the obtained tungsten coating while the composition of plating solution is the same.

关 键 词：脉冲镀 直流镀 镀钨 性能 

分 类 号：TQ153[化学工程—电化学工业]