陶瓷球双自转盘研磨方式下研磨均匀性的研究  

Simulation analysis on lapping uniformity of ceramic balls under dual rotating plates lapping mode

作　　者：陶宝春[1] 王志伟[1] 吕冰海[2] 黄建平[1] 何雪华[1] 袁巨龙[1] 

机构地区：[1]浙江工业大学精密工程研究中心,杭州310014 [2]哈尔滨工业大学机电工程学院,哈尔滨150001

出　　处：《金刚石与磨料磨具工程》2006年第4期43-47,共5页Diamond & Abrasives Engineering

基　　金：国家自然科学基金(50375147)资助

摘　　要：对陶瓷球在双自转研磨盘研磨方式下的研磨均匀性进行仿真分析,表明研磨均匀性不仅取决于自旋角θ变化范围,而且取决于θ角的变化过程和球的自转角速度ωb的变化。对研磨均匀性来说,转速比函数幅值影响较大,相位的影响是很小,可以忽略。当内外下盘转速之比从0到2倍的进行连续周期变化时,可以得到较好的研磨均匀性,变化过程任意。Through simulation analysis on lapping uniformity of ceramic balls under the dual rotating plates lapping mode, it can be indicated that the lapping uniformity not only depends on the variation range of spin angle θ, but also is determined by the variation form of θ and the spin angle speed of ball ωb Compared with the effects of amplitudes of the speed ratio function on the lapping uniformity, the effect of phase is much less. Under optimum amplitudes of the speed ratio function, better lapping uniformity is obtained.

关 键 词：陶瓷球 双自转研磨盘研磨方式 转速比函数 研磨均匀性 

分 类 号：TG58[金属学及工艺—金属切削加工及机床]