导热胶粘剂的研究和应用  

Research and applications of thermal conductive adhesives

作　　者：杜茂平[1] 魏伯荣[1] 

机构地区：[1]西北工业大学应用化学系,陕西省西安市710072

出　　处：《中国胶粘剂》2006年第9期46-50,共5页China Adhesives

摘　　要：综述了导热胶粘剂的导热机理、导热模型以及提高胶粘剂导热性能的途径；详细介绍了非绝缘导热胶粘剂和绝缘导热胶粘剂的技术研究与应用,最后对导热胶粘剂的发展前景作了展望。In this paper, the thermal conducting mechanism and models of thermal conductive adhesive were described,and the approaches of improving thermal conducting were also discussed. The research and applications of thermal conductive adhesives and thermal conductive insulating adhesives were introduced in detail. In the paper end ,the development prospect of thermal conductive adhesive was forecasted.

关 键 词：导热胶粘剂 导热填料 导热机理 导热模型 

分 类 号：TQ436.9[化学工程]