0.1 μmULSI工艺中多层金属布线的热分析  

THERMAL ANALYSIS OF MULTILEVEL METAL ROUTING IN 0.1 μm ULSI TECHNOLOGY

作　　者：何旭曙[1] 黄河[1] 裴颂伟[1] 鲍苏苏[1] 

机构地区：[1]华南师范大学计算机学院,广东广州510631

出　　处：《华南师范大学学报（自然科学版）》2006年第3期54-58,64,共6页Journal of South China Normal University(Natural Science Edition)

基　　金：国家自然科学基金资助项目(60076013)

摘　　要：研究了多层金属互连网络的热学模型,详细计算了不同的介质材料、金属线间距、金属层间距和电流密度对多层金属互连线温度分布的影响.结果表明,考虑这些因素之后,多层金属互连线的温度更加贴近于实际的温度分布,研究结果还为集成电路设计师设计出高性能、高可靠性的芯片提供了理论基础.Thermal model of multilevel metal interconnects is studied. Different dielectric material, metal wire separation, metal level separation and current density for impact of multilevel metal interconnects are calculated in detail. After considering these factors, the result indicates that the temperature of multilevel metal interconnects draws close to the actual temperature distribution much more. Furthermore, the theory foundation is presented so that the IC designer can design chip with higher performance and higher reliability.

关 键 词：多层金属互连网络 金属线间距 金属层间距 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]