热压烧结对NTC热敏电阻稳定性的影响  

The Effect of Sintering with Pressing on the Stability of NTC Thermistors

作　　者：翟继卫[1] 沈波[1] 妥万录 庄顺昌[1] 

机构地区：[1]中国科学院新疆物理研究所.,乌鲁木齐830054

出　　处：《传感技术学报》1996年第4期32-34,共3页Chinese Journal of Sensors and Actuators

摘　　要：对Co-Mn-Ni-O热敏材料进行热压烧结,其材料密度由4.92g/cm^3提高到5.48g/cm^3.以此热压烧结材料制成的热敏电阻,其稳定性提高了一个数量级(同非热压烧结材料相比较).SEM分析表明此材料的晶粒细小、均匀、气孔少,是提高其稳定性的主要原因.The Co-Mn-Ni-O thermal material sintered with pressing, its density is increased from 4. 92 g/cm3 to 5.48 g/cm3. This sintering material has been made intothermistors and the stability is improved on order of magnitude compared with normalone. SEM analysis indicates the grain size of thist material are smaller and homoge-neous, and have less potosity and more compaction. These results are the reasons ofhigh stability.

关 键 词：热敏电阻 负温度系数 热压烧结 稳定性 

分 类 号：TN37[电子电信—物理电子学]