结晶器铜板上激光熔覆镍基合金  

Ni-Based Alloy Cladding on Copper Crystallizer Surface by Laser

作　　者：刘芳[1] 刘常升[1] 陶兴启[2] 陈岁元[1] 

机构地区：[1]东北大学材料与冶金学院,辽宁沈阳110004 [2]沈阳大陆激光成套设备有限公司,辽宁沈阳110136

出　　处：《东北大学学报（自然科学版）》2006年第10期1106-1109,共4页Journal of Northeastern University(Natural Science)

基　　金：国家自然科学基金和上海宝钢集团联合资助项目(50574020).

摘　　要：利用5kWCO2激光器在结晶器铜板上熔覆镍基合金，并研究了熔覆层组织性能．选用与结晶器铜板成分相近的镍基自熔合金粉末Nickel—base HMSP1015—00（Ni1015），利用等离子喷涂技术在铜板上预涂Ni1015合金，然后再采用高能量密度激光进行重熔．借助OM，SEM和显微硬度计分析测定了涂层的显微组织形貌、组织成分和截面显微硬度分布情况．所得到的熔覆层表面平整均匀，与基体为冶金结合；熔覆层平均显微硬度为270HV0．05，是基体的3．2倍（85HV0．05）．确定出本实验合适的激光熔覆工艺参数：功率密度为1．58×100kW／cm^2时，扫描速度为3～4m／min．Copper crystallizer surface was clad with Ni-based alloy by a 5 kW-CO2 laser, and the microstructure and mechanical properties of the cladding were analyzed. The powdered Ni1015 alloy was used as dadding material because its composition is similar to that of the copper plate of crystallizer. The alloy was deposited on Cu substrate by virtue of plasma spraying, then remelted by a high-energy density laser at high scanning speed. By using OM, SEM and microhardness tester, the microstructural morphology/composition and microhardness distribution on the cross-section of the cladding were given. The dadding shows smooth and uniform surface and combines metallurgically with Cu substrate, of which the average micmhardness is 270HV0.05, about 3.2 times as high as that of Cu substrate（85HV0.05）. The results showed that in the testing the optimal process parameters of the laser cladding used are that the laser energy density equals 1.58 × 10^2 kW/cm^2 and laser scanning speed equals 3～4 mm/min.

关 键 词：铜结晶器 激光熔覆 32艺参数 显微组织 显微硬度 

分 类 号：TG113.1[金属学及工艺—物理冶金] TG174.2[金属学及工艺—金属学]