光固化树脂结合剂锯片结合机理及其应用研究  

Research and Application on the Bonding Mechanism of the Photosensitive Resin Blade

作　　者：彭伟[1] 高涛[1] 姚春燕[1] 

机构地区：[1]浙江工业大学机械制造及自动化教育部重点实验室,杭州310014

出　　处：《中国机械工程》2006年第20期2148-2150,2154,共4页China Mechanical Engineering

基　　金：国家自然科学基金资助项目(50075084);浙江省科技攻关重大项目(2005E60008)

摘　　要：探讨了光固化树脂磨具不同于普通树脂磨具的结合机理，并在该理论的基础上寻找出改善磨具结合性能的措施。首次在光固化树脂结合剂锯片中引进几种金属镀覆的金刚石磨料，通过对不同半导体材料进行切割试验，证实了在光固化树脂结合剂锯片中采用金属镀覆金刚石磨料后，针对单晶硅、铌酸锂、陶瓷等半导体材料，几种不同锯片的磨损率分别降低了259／5～200％、12．5％～62．5％和10．5%～52．6％，加工效率和使用寿命有了显著的提高。This paper firstly studied the bonding mechanism of the photosensitive resin blade, and then introduced the effective measures to improve the quality for photosensitive resin blade by means of the metal-coated diamond abrasive and studied the change of bonding ability of the blade compared with conventional abrasive. It has been verified through the SEM photos of blade and the dicing test that the gripping strength between metal-coated abrasive and resin increases greatly. The wear rate of the blades is decreased wariously from 10% to 200% due to different coating materials and different dicing materials.

关 键 词：光固化树脂 锯片 金属镀覆金刚石 结合性能 

分 类 号：TG743[金属学及工艺—刀具与模具]