用正交试验设计改善ITO&CF基板的清洗效果  

Improvement of Cleaning ITO&CF Substrate Surface by Orthogonal Experiment Design

作　　者：张金龙[1] 荆海[1] 马凯[1] 

机构地区：[1]中国科学院长春光学精密机械与物理研究所北方液晶工程研究开发中心,吉林长春130031

出　　处：《液晶与显示》2006年第5期521-526,共6页Chinese Journal of Liquid Crystals and Displays

基　　金：国家自然科学基金资助项目(No.60576056)

摘　　要：分析了ITO及CF玻璃基板表面污染的主要类型为有机物污渍和灰尘颗粒,污染主要来源于产品制作、包装、转运过程。利用正交试验设计法找出影响清洗效果的主要因素是清洗液浓度和超声清洗条件,并确定最优因素水平组合。优化后工艺条件应用于生产实践,测得接触角小于5°,灰尘粒子数平均少于6个;使线间隙≥8.0μm的CSTN-LCD产品生产良品率提高2.85%。The varieties of stain caused by greasy filth and the particle, on the ITO＆CF substrate surface were analyzed. The stain was caused in the process of manufacture, packing and delivery. The key factors, consistency of lotion and ultrasonic cleaning condition, and optimization techniques combination about improving the clean surface were found by means of orthogonal experiment design. With the optimization techniques, the contact angle less than 5°, and the average particle no more than 6 were obtained; The yield of CSTN-LCD with gap over 8.0 μm was improved by 2.85 %.

关 键 词：CSTN-LCD 正交试验设计 有机污渍 灰尘颗粒 超声清洗 接触角 

分 类 号：TN27[电子电信—物理电子学] TN205