纯铜低周疲劳中的温度响应与微观形貌变化  

Temperature Response and the Micrograph Change of Pure Copper under Low Cycle Fatigue

作　　者：李娜[1] 童小燕[2] 姚磊江[2] 

机构地区：[1]西北工业大学航空学院,陕西西安710072 [2]西北工业大学国防科技研究院,陕西西安710072

出　　处：《材料科学与工程学报》2006年第5期754-757,共4页Journal of Materials Science and Engineering

基　　金：西北工业大学英才培养计划资助项目

摘　　要：为了研究纯铜在低周疲劳中的温度响应与微观形貌,借助于红外热像仪及远距离高倍显微镜同步监测工业纯铜的表面疲劳变化,同时运用扫描电子显微镜(SEM)对试样断口进行微观分析。研究结果表明:试样表面温度的变化与表面微观形貌的变化具有明显的相关性,并受应力水平及加载频率的影响,表面最高温升与加载频率呈线性关系;试样断口出现明显的裂纹扩展区和瞬断区,且随着应力水平及加载频率的增加而形成较大的瞬断区及较多的韧窝。The temperature response and the mierograph change of pure copper under low cycle fatigue （LCF） were studied by use of infrared thermography and optical microscopy, and the fracture morphology was analyzed with Scan Electron Microscopy（SEM）. The results show that there are obvious relationships between the temperature response and the microscopic shape, furthermore, the stress level and the load frequency effect the change of the surface temperature. There exists a specifically linear relation between the highest temperature rising and the load frequency. The fracture morphology appears obvious extend zone of crack and instant rupture zone, which is larger and possesses more dimple along with the increasing stress level and load frequency.

关 键 词：温度响应 微观形貌 低周疲劳 应力水平 加载频率 

分 类 号：TG111.8[金属学及工艺—物理冶金]