纳米碳化硅增强铜基复合材料的组织及其磨损性能  

Microstructure and Wear Resistance of Cu/nano-SiC Composite

作　　者：朱建华[1] 刘磊[1] 赵海军[1] 沈彬[1] 胡文彬[1] 

机构地区：[1]上海交通大学金属基复合材料国家重点实验室,上海200030

出　　处：《机械工程材料》2006年第10期46-48,65,共4页Materials For Mechanical Engineering

基　　金：国家自然科学基金资助项目(50401004);国家高科技研究发展计划资助项目(2002AA334010);上海市科委重点新材料重点资助项目(035211037)

摘　　要：为了探求在常温下制备颗粒弥散增强金属基复合材料的方法,采用复合电铸工艺在室温下制备了纳米碳化硅粒子弥散增强铜基复合材料,对其表面形貌、微观组织结构进行了观察,对显微硬度、磨损性能及导电性能进行了测试。结果表明:纳米碳化硅粒子均匀弥散分布在铜基体中,且与基体结合良好;复合材料表面平整、细密;与电沉积纯铜材料相比,其显微硬度明显提高,磨损性能改善,导电性能下降幅度不大。In order to explorie a method of preparing particles reinforced metal matrix composites at room temperature, the composite eleetroforming technique was used to fabricate nano-sized carbide silicon particles （nanoSiC） reinforced copper composite. The surface morphology, microstructure, microhardness, wear resistance and electrical resistivity （Er） were investigated. The nano-SiC was embedded in copper matrix uniformly and tightly. The surface of composite was smooth, fine and compact. The composite exhibited higher mierohardness and better wear resistance than pure copper deposit, and the change range of E, was small.

关 键 词：复合电铸 纳米碳化硅粒子 铜基复合材料 磨损性能 

分 类 号：TQ153[化学工程—电化学工业]