ABS塑料局部电镀——电解屏蔽法  

Local Plating of ABS Plastic with Electrolytic Shield

作　　者：麻忠诚 汪兰芳 张彩瑞 

机构地区：[1]河南新乡760厂

出　　处：《电镀与环保》1990年第1期6-9,共4页Electroplating & Pollution Control

摘　　要：为了满足电子产品的电气要求,电子产品所用的塑料件,常常需要局部电镀。局部电镀的方法很多,常用的有退铜法和套塑料管法,但都受零件形状的限制,有一定的局限性。例如旋钮就不能用上述方法进行局部电镀。为此本文发展了电解屏蔽法,采用屏蔽挂钩,将不需要镀的地方屏蔽起来。由于屏蔽效应,使被屏蔽部位的电流密度达不到镀层析出所必需的极限电流密度。因此当电镀铜/镍/铬镀层时,被屏蔽部位最多只能镀上一薄层铜和镍,而不可能镀上铬。这样在电镀后再在硝酸和硝酸铵溶液中或在硝酸和铬酸溶液中退除铜镍镀层,由于铬层不受侵蚀,仍能维持不变。这样就完成了局部电镀。本法简单、可靠、适合复杂另件的局部电镀。In order to meet the electric requirements of the electronic products, the involving plastic parts often need partial plating, for which many methods are provided, and the most commonly used are copper stripping method and plastic sleeve method. However, their applications are limited due to the complica- ted shape of the parts. For example, such electronic product as the screw knob can not be partially plated by the above methods. On this account, an electrolytical shield method was developed, in which screening hooks were used to mask the parts not intended for plating. Due to the shielding effect, the current density on the screening area was not easy to reach the limit current density. So that, in Cu/Ni/Cr multi-layer plating, there would only be a thin layer of Cu and Ni to be plated on the shield portions, and no Cr could probably be plated out. After plating, the Cu and Ni layer could be removed by di- pplng in nitric acid plus ammonium nitrate solution or nitric and chromic acid solution. Since the above dipping solutions have no effect on Cr layer, it could still keep its original state, Therefore, the local plating of screw knob with satisfactory result was accomplished. This process is simple and reliable,- adquate for local plating of the parts with complicated shape.

关 键 词：ABS塑料 局部电镀 电解屏蔽法 

分 类 号：TQ153.3[化学工程—电化学工业]