酸性光亮镀锡稳定剂研究  

Studies on Stabilizer of Aeid Bright Tin Plating

作　　者：赖龙君 

出　　处：《电镀与环保》1990年第2期10-13,共4页Electroplating & Pollution Control

摘　　要：酸性光亮镀锡存在的主要问题是经过一段时间后,镀液会变得混浊。由于混浊,使镀层光泽度变差,光亮电流密度范围变窄,而且高温老化后的可焊性恶化。为了解决这个问题,很多人进行了研究,但结果均不理想。本文提出用氢氟酸作为阳极电位调节刺和络合剂,次亚磷酸钠作为氧和Sn^(4+)的还原剂以及Sn^(4+)的沉淀剂,进行了试验。试验结果,镀液稳定性显著提高,即使是已浑浊的镀液,加入后,停放一段时间,浑浊也会自然沉降,然后滤去。另外,添加后的镀层可焊性好。缺点是低电流密度区的光泽较差,允许的操作温度较低并有氟的污染,有待改进。The main problem in acid bright tin plating is that the bath will become turbid after a period of time, making the brightness of coating poorer, the range of bright current density narrower and the solderability after high temperature aging worse. In order to solve the pro- blem, a series of tests have been performed by researchers, but none of them are satisfsa- tory. Thus, a new type of stabilizer is recommended, in which hydrofluoric acid is used as anode potential adjusting agent and complexing agent, Sodium hypophosphite as reducer of O_2 and Sn^(4+) and the precipitating agent of Sn^(4+). Test result shows that, due to the addition of stabilizer, the stability of the bath is greatly improved. Even in the bath which has already turned turbid, after staying still for a period of time, the turbid matter will natually settle out and the bath will become clear again. Besides, the solderability of the deposit is also increased. However, the brightness in low current density area is poorer, the permitted operating temperature is lower and there is pollution from fluorine, which are awaiting to be further improved.

关 键 词：镀锡 稳定剂 镀液 镀层 电镀 

分 类 号：TQ153.13[化学工程—电化学工业]