镍-磷/金纳米粒子复合化学镀层的研究  

Study of the nano composite electroless coating of Ni-P/Au

作　　者：马洪芳[1] 陈慎豪[1] 田芳[1] 冯媛媛[1] 

机构地区：[1]山东大学化学与化工学院

出　　处：《山东大学学报（理学版）》2006年第5期124-128,143,共6页Journal of Shandong University(Natural Science)

基　　金：国家自然科学基金资助项目(20573069)

摘　　要：在化学镀镍磷溶液中添加金纳米粒子,在基体钢铁上沉积得到镍-磷/金纳米粒子复合镀层.金纳米粒子在镀液中的浓度为1.0μmol.L-1.用扫描电子显微镜,能谱仪,示差扫描热量分析仪,X-射线衍射仪,显微硬度计等仪器对镀层性能进行了分析.通过EDS分析表明,Ni-P镀层中P的质量分数为9.72%,而Ni-P/Au镀层中P质量分数为9.29%,金的质量分数为0.93%.与镍-磷合金镀层相比,纳米复合镀层具有较高的硬度,并且镀层组织致密,孔隙率小,对基体具有更好的保护作用.The nano composite coating of Ni-P/Au was obtained by adding gold nanoparticles into the Ni-P electroless plating solu- tions. The concentration of gold nanoparticles in electroless plating solution is 1.0 μmol·L^-1. . The coating properties were analyzed by scanning electron microscopy （SEM）, energy dispersive spectrometry （EDS）, differential scanning calorimeter （DSC）, X-ray diffraction （XRD） and micro-hardness tester. The mass concentration of P in Ni-P electroless coating is 9.72 %, while that in the composite coating of Ni-P/Au is 9.29 % and that of Au in the composite coating is 0.93 %. The hardness of the composite coating is bigger than that of Ni-P alloy coating. The composite coating of Ni-P/Au has good protection on the substrate because of its compact structure andless holes.

关 键 词：镍磷化学镀 金纳米粒子 纳米复合镀 

分 类 号：TQ153[化学工程—电化学工业]