金刚石磨粒激光钎焊的试验研究  

Experimental study on laser welding of diamond grains

作　　者：张义平[1] 

机构地区：[1]苏州市职业大学机电工程系

出　　处：《金刚石与磨料磨具工程》2006年第5期36-39,共4页Diamond & Abrasives Engineering

基　　金：江苏省自然科学基金资助项目(BK2002094)

摘　　要：激光钎焊用于金刚石磨粒与基体的焊接，因激光具有高的功率密度，可实现快速加热和降温，有效控制金刚石磨粒的热损伤；由于热影响区小，可保证基体基本不变形。本文主要研究了金刚石磨粒的激光钎焊。重点讨论了激光功率、扫描速度及光斑直径等参数对连接界面的影响；讨论了其结合界面的微观形貌及热损伤、开裂等缺陷。研究结果表明，当ρ在25～30J／mm^3范围，可以实现激光钎焊金刚石颗粒与基体45钢的优良焊接。Laser soldering is used to weld diamond grains and metal workpieces. As laser possesses characteristic of high power density, increase or decrease of heat can be carried out rapidly to control efficiently thermal damage of diamond grains. Moreover, the small area of heat influence is favorable to keep the workpiece undeformed. In this paper an experimental investigation was made on laser soldering of diamond grain. The effects of laser power, scanning speed and light spot diameter on the conjunction interface were emphasized. The drawbacks such as the morphology, thermal damage and crack on the conjunction interface were also discussed. The experimental results showed that a strong joint between diamond grains and 45 steel could be achieved by laser soldering when the parameter of ＂ρ＂ is about 25- 30J/mm^3.

关 键 词：金刚石磨粒 激光钎焊 焊接参数 

分 类 号：TQ164[化学工程—高温制品工业]