SiC_p/Al复合材料表面无钯活化化学镀镍的研究  

Study of electroless Ni plating with palladium-free activation on the surface of SiC_p/Al composites

作　　者：李丽波[1] 安茂忠[1] 武高辉[2] 杨敏[1] 

机构地区：[1]哈尔滨工业大学理学院应用化学系,黑龙江哈尔滨150001 [2]哈尔滨工业大学材料科学与工程学院,黑龙江哈尔滨150001

出　　处：《材料科学与工艺》2006年第5期490-494,共5页Materials Science and Technology

基　　金：哈尔滨工业大学跨学科交叉性研究基金资助项目(HIT.MD.2002.17)

摘　　要：采用特定的无钯直接活化法在S iCp/A l复合材料表面进行活化,获得了光亮、完整且结合强度良好的N i-P合金镀层.通过扫描电子显微镜和能谱等测试手段对镀层和活化前后的基体表面形貌、元素组成进行了研究,考察了活化时间、超声波、热处理温度和时间等因素对镀层质量、结合强度及沉积速度的影响,确定了在高体积分数的S iCp/A l复合材料上化学镀镍的最佳前处理工艺.研究表明:本文得到的最佳的无钯活化工艺过程为:直接用由N i(Ac)2(g)、NaH2PO2(g)、CH3CH2OH(mL)和H2O(mL)以1∶1∶15∶2比例组成的无钯活化液对基体进行活化,在超声波辅助下活化9 m in,然后在170℃下热处理20 m in;无钯活化后的基体表面覆盖了一层N i-P活化膜,该活化层对化学镀镍具有良好的催化效果.The direct palladium-free activation is used to render the surface of SiCp/Al composites higher active in order to obtain glossy and uniform Ni - P film with excellent adhesive strength to the substrate. The morphology and the elemental compositions of the coatings and the specimens before and after activation are clarified by the scanning electron microscopy and X-ray energy dispersive spectrometer. Influences of the activation factors such as time, ultrasonic, the temperature and time of the heat treatment on the coating quality, adhesion and deposition rate are investigated. The optimal pretreatment conditions are obtained to deposit nickel on the surface of the SiCp/Al composites reinforced with 70 volume percent fine particulate silicon carbide. Results show that the optimal palladium-free activation conditions are obtained, with palladium-free activation for 9 rain under ultrasonic, then heat treatment at 170 ℃ for 20 min, and the solution contains Ni（Ac）2（g） ,NaH2PO2（g） ,CH3CH2OH （ml） and H2O（ml） in proportion of 1： 1： 15： 2. The Ni-P activated film which has high catalysis for eleetroless Ni plating covers the composites surface after the palladiumfree activation.

关 键 词：无钯直接活化 前处理 SiCp/AI复合材料 化学镀镍 

分 类 号：TQ153.1[化学工程—电化学工业]