酚醛树脂/木粉复合体系的固化行为研究  

Study on curing behaviors for phenolic resins /wood flour system

作　　者：刘胜平[1] 季庆娟[1] 马源[1] 赵春秋[1] 

机构地区：[1]华东理工大学,上海201512

出　　处：《宁波职业技术学院学报》2006年第5期1-3,10,共4页Journal of Ningbo Polytechnic

摘　　要：采用DSC方法探讨了酚醛摩尔比(F/P)为1.3,1.5,1.8酚醛树脂的固化反应过程。运用DSC技术分析了热固性酚醛树脂/木粉复合体系在不同温度下的固化行为。运用Kissinger和Ozawa法进行了动力学研究,得到其固化反应活化能。结果表明,酚醛树脂的F/P摩尔比越高,固化反应的活化能就越低。木粉的加入加速了酚醛树脂固化反应,同时也降低了酚醛树脂固化反应活化能。Differential Scanning Calorimetry（DSC） was used to study the curing behavior of phenolic resins with different formaldehyde/phenol（F/P） and the curing behavior of phenolic resins/wood flour system by dynamic method. Curing reaction kinetic parameters was obtained by data processed by means of Kissinger and Ozawa method. DSC analysis showed that less heat was needed to cure the high molar ratio resins. The addition of wood to the resins accelerated the addition reaction in the curing process of phenolic resins and reduced the activation energies for phenolic resins.

关 键 词：酚醛树脂 木粉 固化行为 DSC 

分 类 号：O632.72[理学—高分子化学]