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作 者:周怡琳[1]
出 处:《电子学报》2006年第10期1852-1855,共4页Acta Electronica Sinica
基 金:国家自然科学基金(No.50277002)
摘 要:评价同轴连接器镀金层质量需检测连接器触点表面镀金层的抗磨损能力,以防止镀金层磨穿后基底非贵金属材料暴露,在连接器长期使用中发生腐蚀,而造成电接触失效.连接器触点表面硬度、磨损前后镀金层厚度变化可以作为连接器镀金层抗磨损能力的参考数据.使用潮湿二氧化硫单一气体加速腐蚀,并配以光学显微镜、扫描电子显微镜检测镀金层磨穿的特征点,是检测同轴连接器镀金层抗磨损能力的一种较好的方法.To evaluate the quality of gold plating on coaxial connectors, the wear resistance of gold plating must be tested because the base materials of connectors would be exposed and corroded during applications if the gold plating were worn out, which would lead to contact failure. The surface hardness of contacts on connectors and the thickness change of gold plating before and after mating can be taken as the references for wear resistance ability of gold plating. Single gas (sulfur dioxide) accelerated corrosion joint with the optical microscope and the scanning electronic microscope can disclose the characteristic points where the gold plating are worn out. This is a good method to evaluate wear resistance ability of gold plating on coaxial connectors.
分 类 号:TQ153.18[化学工程—电化学工业]
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