选择性螯合滴定法测定电镀液中的锡铜铅  

Determination of Tin,Copper,Lean in Electroplating Solution by Selective Chelatometry

作　　者：王献科 李玉萍 

机构地区：[1]兰州东岗镇钢厂,甘肃兰州730020

出　　处：《化工技术与开发》2006年第10期30-33,共4页Technology & Development of Chemical Industry

摘　　要：提出了测定电镀液中锡铜铅的一个简易快速螯合滴定法。用EDTA螯合锡(Ⅳ)、铜(Ⅱ)、铅(Ⅱ)和其它金属离子,然后分别用三羟基苯甲酸、巯基丁二酸和氨荒丙酸解蔽。释放出的EDTA,用锌标准溶液反滴定(XO-CPB为混合指示剂)。终点变化相当敏锐。研究了测定锡、铜、铅时一般共存离子的干扰。此法已被成功地用于测定锡-铜-铅合金电镀液和镀层锡铜铅合金中的锡、铜和铅。One rapid chelatometry for the determination of Sn, Cu an Pb in the electroplating solutlon was introduced. After the clelation with Sn（ Ⅳ ）, Cu（ Ⅱ ）, Pb（ Ⅱ ） and other metal ions, EUFA solution was demaskinged with trihydroxybenzoic acid, mercaptosuccinic acid and dithiocarbamic propanoic acid respectively. The liberated EDTA was titrated with Zn（ Ⅱ ） standard solution applied xylenol orange-CPB as mixed indicator. The influence of coexistence ions was studied. This method had been used for the determination of Sn ,Cu,Pb in Sn-Cu-Pb alloy plating solution and alloy coating.

关 键 词：锡铜铅 电镀液 释放剂 选择性螯合滴定法 

分 类 号：O655.25[理学—分析化学]