新型Ag-Cu-Ge钎料的性能及钎焊界面特征  

Properties and interface microstructure of new type Ag-Cu-Ge solder

作　　者：岳译新[1] 谭澄宇[1] 郑子樵[1] 李世晨[1] 叶建军[2] 

机构地区：[1]中南大学材料科学与工程学院,长沙410083 [2]南京电子器件研究所,南京210016

出　　处：《中国有色金属学报》2006年第10期1793-1798,共6页The Chinese Journal of Nonferrous Metals

基　　金：国家科研资助项目(MKPT04106)

摘　　要：根据Ag—Cu-Ge系三元相图，制备了Ag-Cu33．4-Ge28．1，Ag-Cu43-Ge20（质量分数，％）两种中温合金钎料。利用金相显微镜、DTA对钎料组织及其熔点进行分析，并对其润湿性进行测试。结果表明：两种合金钎料的熔化温区为539～622℃，Ag—Cu33．4-Ge28．1合金对于纯Ni和Cu具有良好的漫流性和润湿性。利用扫描电镜和能谱仪对钎焊后的界面微观组织进行观察与分析，发现在界面处形成了固溶体和金属间化合物。According to Ag-Cu-Ge phase diagram, two solders Ag-Cu33.4-Ge28.1 and Ag-Cu43-Ge20 （mass fraction, %） were designed. The microstructure and melting point of two solders were studied by optical microscope and differential thermal analysis（DTA）, and the wettability of solders with base metal was tested. The results show that, the melting temperatures of the two solders are in the range of 539 - 622 ℃, Ag-Cu33.4-Ge28. 1 solder has good flowability and wettability to Ni and Cu substrates. The scanning electron microscope equipped with energy dispersive X-ray （EDX） analysis system was used to inspect and analyze the interfacial microstructure, and the solid solution and intermetallic compounds were found in interface.

关 键 词：Ag—Cu—Ge 钎料 润湿性 界面 

分 类 号：TG425.2[金属学及工艺—焊接]