高锰酸钾溶液粗化环氧树脂板的研究  

A Study on Potassium Permanganate Solution Roughening Epoxy Resin Boards

作　　者：王秀文[1] 姜洪艳[1] 刘志鹃[1] 王增林[1] 

机构地区：[1]陕西师范大学化学与材料科学学院,陕西西安710062

出　　处：《电镀与精饰》2006年第6期9-13,25,共6页Plating & Finishing

基　　金：国家自然科学基金资助项目(20573073);陕西省自然科学基金资助项目(2005B13)

摘　　要：在不同的微蚀温度、时间条件下,研究了高锰酸钾微蚀溶液对环氧树脂层压板和3240型环氧树脂板(基板)微蚀作用的影响。通过基板表面形貌的观察和对化学镀铜层与基板间粘结强度的测定,研究和比较了高锰酸钾体系和传统的铬酐-浓硫酸体系对两种基板的微蚀效果。结果表明,经过高锰酸钾溶液处理后,环氧树脂层压板和3240型环氧板粘结强度分别可达到5.88 N/cm和2.35N/cm,远远高于传统的铬酐-浓硫酸处理后镀铜层与基板的粘结强度;同时,使用高锰酸钾溶液可以减小环境污染,且操作简单易行,它作为新型的微蚀体系有望取代传统的铬酐-浓硫酸微蚀体系。Effect of potassium permanganate etching solution on the roughening of epoxy resin laminates board and 3240 epoxy resin board at various temperatures and times was investigated. Etching effects of potassium permanganate etching solution and traditional chromic acid-sulfuric acid solution were researched and compared by observations of surface morphology and measurements of peel strength between electroless copper coating and the substrate. The results show that peel strengths of epoxy resin laminates and 3240 epoxy resin reach 5. 88 N/cm and 2. 35 N/cm respectively after treatment of potassium permanganate etching solution, which were much higher than that after treated with traditional chromic acid-sulfuric acid etching solution. Meanwhile, because of low enviromental pollution and easy operation condition, potassium perman- ganate etching solution will replace traditional chromic acid-sulfuric acid system.

关 键 词：高锰酸钾 铬酐-浓硫酸 环氧树脂板 粘结强度 

分 类 号：TG178[金属学及工艺—金属表面处理]