电子器件空气强制对流冷却研究  

Study on Forced Air Convection Cooling for Electronic Assemblies

作　　者：李斌[1] 陶文铨[1] 何雅玲[1] 

机构地区：[1]西安交通大学动力工程多相流国家重点实验室,西安710049

出　　处：《西安交通大学学报》2006年第11期1241-1245,共5页Journal of Xi'an Jiaotong University

基　　金：国家自然科学基金资助项目(50476046)

摘　　要：运用翅片开缝等设计思想,对电子器件空气冷却平片散热器中的翅片进行改进,并对连续平片、分段平片、分段开缝翅片等散热器进行了层流流动与换热的数值模拟.研究发现,在相同风扇泵功条件下,分段平片性能优于连续平片,开缝翅片优于分段平片.提出了一种适用于冷却要求更高的新型散热器,相比原散热器,新型散热器翅片间距和翅片厚度更小,翅片开缝且分段.初步研究表明,这种新型散热器在风扇功率足够的情况下,可以用于下一代热负荷更高的CPU,并讨论了常规的空气强制对流冷却的极限问题.In the present work, the slotted fin concept was employed to improve the air cooling performance for heat sinks of plate-fin type. Numerical simulations of laminar heat transfer and flow pressured drop were conducted for the integral plate fin, discrete plate fin, and discrete slotted fin heat sinks. It is found that the performance of the discrete plate fin is better than that of integral plate fin and the performance of slotted fin is better than that of discrete plate fin based on the same pumping power of the fan. Then a new type of heat sink was proposed, which is characterized by discrete and slotted fin surface with thinner fin height and shorter fin spacing. Preliminary computation shows that this type of heat sink may be useful for the next generation of CPU of higher thermal load with an efficient fan. The issue of the limit of air-cooling tech- niques was also analysed.

关 键 词：电子器件 散热器 翅片开缝 翅片分段 

分 类 号：TK124[动力工程及工程热物理—工程热物理]