均匀设计法对ABS树脂表面金属化条件的选择  

Choice of Condition of ABS Resin Surface Metallitation by Uniform Design

作　　者：孙益民[1] 袁顺香[1] 李俊[1] 孟祥珍[1] 胡娟[1] 晋顺和[2] 

机构地区：[1]安徽师范大学化学与材料科学学院,安徽省功能性分子固体重点实验室 [2]安徽芜湖清源电器有限公司,安徽芜湖241000

出　　处：《安徽师范大学学报（自然科学版）》2006年第5期454-457,共4页Journal of Anhui Normal University(Natural Science)

基　　金：安徽省教育厅自然科学重点项目(2005KJ016ZD)

摘　　要：将CuCl2、Pb(Ac)2含量一定的ABS树脂薄膜于一定浓度的NaBH4水溶液中处理一段时间,就能得到导电性能良好的导电薄板.影响其导电性能的因素包括添加树脂的质量,添加金属的质量,还原剂浓度,还原时间和还原温度等,因为影响因素较多,本文采用均匀设计法进行试验,分析各个因素对导电薄膜的影响作用.Electric macromolecule films were obtained by the reduction of the ABS resin film containing CuCl2 , Pb（AC）2 with NaBH4 aqueous solution. The metalized films exhibited excellent surface conductivity. Surface resistance of the metal layer is influenced by the mass of resin and metal salt, the concentration of the reducing agent, the reduction time and the reduction temperature. Because of too many ingredients, this test uses uniform design to process experiment, to study how every ingredient influences the conductivity of the metalized films.

关 键 词：表面金属化 均匀设计法 导电性 

分 类 号：O631.24[理学—高分子化学]