低温下Cu-Cu固体间界面热阻的激光光热法研究  

Experimental Research on The Thermal Contact Resistance by Photothermal Measurement Between Cu-Cu in Low Temperature

作　　者：彭小方[1] 石零[1] 王建[1] 赵琰[1] 王惠龄[1] 

机构地区：[1]华中科技大学制冷与低温研究所,湖北武汉430074

出　　处：《低温与特气》2006年第5期34-37,共4页Low Temperature and Specialty Gases

基　　金：教育部博士学科专项基金(20040487039);国家自然科学基金(51076013)

摘　　要：以GM制冷机(20K/5W)作为冷源,用激光光热方法对低温下Cu-Cu固体接触界面热阻进行了测量。实验数据表明,在一定的压力(3.0 kPa)和温度范围(20~120 K)内,Cu-Cu接触界面热阻从2.445×10-2m2.K/W减小至3.022×10-3m2.K/W,同时,在一定的温度(80 K)和压力范围(3.0 kPa^0.32 MPa)内,界面热阻从5.547×10-3m2.K/W减小至2.876×10-4m2.K/W。从微尺度的角度对该变化规律进行了机理分析。The thermal contact resistance （TCR） of Cu-Cu interface under the temperature （20 - 120 K） and the vacuum （ 10-3 Pa） had been measured using photothermal measurement on the G-M cryocooler with 20K/5W capacity. The experimental data shows that the TCR of Cu-Cu interface decreases from 2. 445 × 10^-2 m^2 · K/W to 3.022 × 10^-3 m^2 · K/W when contact load persisting at 3.0 kPa and decreases from 5. 547 × 10^-3 m^2 · K/W to 2. 876 × 10^-4 m^2·K/W when contact temperature persisting at 80 K and contact load increases from 3.0 kPa to 0. 32 MPa. An analysis based on micro-and nano-structural cryogenic concept was made for explaining this change.

关 键 词：界面层接触热阻 激光光热测量技术 

分 类 号：O513[理学—低温物理]