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作 者:袁诗璞
出 处:《电镀与涂饰》2006年第11期55-57,63,共4页Electroplating & Finishing
摘 要:通过分析镀铬液硫铬比与分散能力的关系,经过大量的试验发现,适当提高铬酐与硫酸的比值,在100∶0.5左右;调整铬酐含量,在约200 g/L;可以在不加任何添加剂的情况下,在处于活化状态的亮镍镀层上套铬,实现宽光亮范围的低温镀装饰铬。该工艺节能、环保,经数年大生产应用,镀液性能和镀层质量良好。The relationship between throwing power and ratio of mass concentration of chromic acid to sulfuric acid in chromium plating solution was analysed. Plenty of experimental results showed that chromium plating deposit can be applied to activated bright nickel deposit while the ratio of mass concentration of chromic acid to sulfuric acid was properly raised to about 100: 0.5, and the mass concentration of chromic acld was adjusted to about 200 g/L. The low temperature decorative chromium plating process has a wide bright range without addition of any additives. It 's energysaving and environmental friendly. After several years of industry practice, the solution performance and deposit quality of the process are proven to be quite good.
分 类 号:TQ153.11[化学工程—电化学工业]
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