高精度无油封压力传感器设计  

Design of high-accuracy oil-less package pressure sensor

作　　者：崔光浩[1] 闻化 雷钢[1] 张爱平 

机构地区：[1]中国电子科技集团公司第四十九研究所,黑龙江哈尔滨150001 [2]空军驻黑龙江地区军事代表处,黑龙江哈尔滨150046

出　　处：《传感器与微系统》2006年第11期55-56,60,共3页Transducer and Microsystem Technologies

摘　　要：设计了一种新的传感器封装方法。该方法采用双膜片结构，无油封装。压力膜片为硅一蓝宝石材料，通过硅的压阻效应，利用下膜片实现压力传递，上膜片的惠斯登电桥将感受的压力转换为电压信号。经过温度补偿，使热漂移信号大幅度降低。试验结果表明：在常温条件下，传感器准确度为0．14％FS。在-55～200℃范围内，热零点漂移为0．48×10^-3％FS／℃，热灵敏度漂移为0．61×10^-3％FS/℃。A new sensor packaging method is designed. Based on piezoresistive effect, the non-oil filled senor is packaged in double-diaphragm. One of the pressure diaphragms is made of silicon-on-sapphire. The pressure is transferred by the bottom diaphragm, and the pressure signal is converted into voltage signal by the Wheatstone bridge on the upper diaphragm. Due to temperature compensation, thermal drift of the sensor is reduced greatly. The experiment result indicates that the accuracy of sensor can he 0, 14 % FS at room temperature,offset thermal shift is 0.48 ×10^-3%FS/℃ and thermal sensitivity shift can be 0.61 ×10^-3%FS/℃ at the range of -55 -200℃.

关 键 词：压力传感器 高精度 双膜片 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]