对高频PCB设计的研究  

A Study on Design of High Frequency PCB

作　　者：周涛[1] 姚炯辉[1] 

机构地区：[1]北华航天工业学院电子工程系,河北省廊坊市065000

出　　处：《电子工程师》2006年第11期34-36,共3页Electronic Engineer

摘　　要：基于Protel 99 SE在高频PCB(印制电路板)设计与制作过程中,从高频PCB的布局、布线、焊盘及敷铜几个方面对散热、EMC(电磁兼容)、EM I(电磁干扰)及PCB的可制造性等问题进行研究,探讨了解决问题的技巧及方法。实践结果表明,在实际高频PCB设计与制作中取得了很好的效果。This study aims at resolving some technical problems such as radiated heat, EMC, EMI and processing in the design of High Frequency PCB based on Prote199 SE for overall configuration and connection layout. In addition, some suggestions were given to its manufacturing process including the pads and the copper spreading. The results of practice showed that all suggested techniques work well.

关 键 词：高频 PCB 布局 布线 

分 类 号：TN702[电子电信—电路与系统]