纳米尺度拉伸变形行为的分子动力学模拟  

Molecular dynamics simulation of tensile deformation behavior at nanometer scale

作　　者：韩志萍[1] 袁林[1] 单德彬[1] 郭斌[1] 

机构地区：[1]哈尔滨工业大学材料科学与工程学院,哈尔滨150001

出　　处：《哈尔滨工业大学学报》2006年第10期1677-1680,共4页Journal of Harbin Institute of Technology

基　　金：国家自然科学基金资助项目(50275033);(50475030);国家高技术研究发展规划资助项目(2004AA404260)

摘　　要：为了研究单晶面心立方材料在纳米尺度下的拉伸变形机理,采用分子动力学方法模拟了单晶Cu的拉伸变形过程,并研究了不同温度、不同应变速率对其拉伸变形行为的影响.结果表明:不同温度对单晶Cu屈服强度影响明显,温度越高,屈服强度越低;不同应变速率对拉伸过程的弹性变形和屈服机理没有影响,但对塑性变形影响大,应变速率越大,屈服强度越大.In order to study the tension mechanisms of Fcc metals, molecular dynamics simulation was carried out on the tension process of single crystal copper, and the effects of different temperatures and strain velocities on the tensile behavior were also studied. The results show that the temperature has an obvious influence on the yield stress. The yield stress decreases obviously with the increase of temperature. And the strain velocity has no effect on the elastic behavior and yield mechanism, but has effect on the plastic behavior. With the increase of strain velocity, the tension yield stress increases accordingly.

关 键 词：分子动力学 单晶Cu 拉伸 

分 类 号：TG301[金属学及工艺—金属压力加工]