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机构地区:[1]华南理工大学工业装备与控制工程学院,广东广州510640
出 处:《电镀与环保》2006年第6期23-25,共3页Electroplating & Pollution Control
摘 要:采用硫酸镍为主盐、次磷酸钠为还原剂,并在镀液中加入氟化物和稳定剂,研究了镁合金的化学镀镍工艺。运用正交试验分析了镀液中各主要组分对镀速及耐蚀性等影响,优选化学镀最佳工艺。该工艺沉积速率快,镀层耐蚀性优异。运用X-射线衍射方法对镀层的组织结构进行了分析,结果表明,镁合金化学镀镍层由非晶态的镍及部分微晶的镍组成。The process of electroless nickel plating for magnesium alloys is developed by addition of fluoride and stabilizer in bath and using nickel sulfate as nickel resource and sodium hypophosphite as reducing agent. The effects of the main compositions in bath on deposition rate and corrosion resistance of the deposits are analyzed, and the optimun process is determined by orthogonal test. The process is fast in deposition speed and excellent in corrosion resistance of the coating. The structure of the deposits is analyzed by X-ray diffraction (XRD). The results show that the electroless nickel deposits on magnesium alloys are composed mostly of amorphous nickel and partially of mierocrystalline nickel.
分 类 号:TQ153[化学工程—电化学工业]
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