半导体泵浦激光器在选区激光熔化工艺中的应用研究  

Application of a Diode Pumped Laser to the Selective Laser Melting Processing

作　　者：吴伟辉[1] 杨永强[1] 

机构地区：[1]华南理工大学机械工程学院,广东广州510640

出　　处：《机电工程技术》2006年第11期91-94,共4页Mechanical & Electrical Engineering Technology

基　　金：广东省科技攻关项目(项目编号:2004A10403004)

摘　　要：选区激光熔化是新出现的能直接成型致密性接近100%终端金属产品的快速成型技术,该技术对成型能量源的要求严格。半导体泵浦激光器具有电光转换效率高、性能可靠、体积小巧、使用寿命长、输出光束质量好等优点。本文分析了选区激光熔化工艺对能量源的选用要求,对将半导体侧向泵浦Nd押YAG激光器应用于选区激光熔化工艺的可行性进行了评估,并通过实验进一步验证了评估结果。Direct Manufacturing of Metal parts by Selective Laser Melting(SLM)is a newly rapid prototyping technology.Metal parts with high density approximately 100% are produced by SLM in one step.In order to obtain high prototyping density and good dimensional precision,a strict selection on processing power is necessary.Diode Side-Pumped Laser(DSPL)has many advantages,such as high transferring efficiency,compact volume,long using life and good laser beam quality,etc.In this paper,The using demands of processing power in SLM is analyzed,and the possibility using DSPL in SLM is evaluated,furthermore,some experiments are done to test the evaluation.

关 键 词：半导体侧向泵浦Nd:YAG激光器 选区激光熔化 快速成型 

分 类 号：TN248.2[电子电信—物理电子学]