三层端电极渗边现象的研究  

Reseach on Permeation in Trilayer Terminal Electrodes of MLC

作　　者：蒋端六[1] 李东豪 

机构地区：[1]无锡教育学院 [2]无锡县无线电元件二厂

出　　处：《电子元件与材料》1996年第4期46-49,共4页Electronic Components And Materials

摘　　要：多层陶瓷电容器的端电极在进行电镀镍和锡铅合金时常会出现两边的端电极金属层向瓷体中间逐渐延伸的渗边现象，采用一种前处理化学浸液，对ＭＬＣ芯片进行浸入处理后。In process of Ni and Sn Pb plating terminal electrodes of multilayer ceramic capacitor (MLC) permeation of metal layer on terminals from edges to middle of body appears. This phenominon may be thoroughly eliminated by immersion of chips of MLCs in a pretreating chemical immersing liquid.

关 键 词：多层陶瓷电容器 电极 渗边 陶瓷电容器 电容器 

分 类 号：TM534.1[电气工程—电器]