基于ANSYS的COG邦定机压头热应变分析  

The Thermal-Structural Analysis of Press Part in COG Bonding Machine with ANSYS

作　　者：龙海强[1] 郭文谦[1] 徐键[1] 田兴志[1] 

机构地区：[1]吉林长春市中国科学院长春光学精密机械与物理研究所

出　　处：《微计算机信息》2006年第12S期253-255,97,共4页Control & Automation

基　　金：2005年度省院合作资金资助项目(2005SYHZ0015)

摘　　要：COG邦定机是液晶模块生产中的关键设备,是集光学、计算机控制、图像识别处理、精密机械等多学科技术于一体的高精度、高可靠性微电子专用设备。邦定机压头是拾取芯片进入CCD物方视场进行图像识别采样并最终完成压接的重要部件之一。由于CCD相机物方视场较小,压头工作中因加热引起的热变形影响CCD图像识别,往往使得加热后IC的图像识别模糊不清。本文利用ANSYS软件成熟的热应力分析功能分析并获得了压头热变形理论值,结合实际测量验证了有限元分析结果,以理论分析结果进行压头调节获得了较理想的IC标识CCD图像识别效果。COG bonding machine is so crucial that widely used in LCD industry, it is a kind of micro-electronic equipment with high precision and reliability, and it relates to the sciences and technologies in such fields as optics, computer control, image identification and process, and fine mechanics. The press part is one of the vital pans in COG bonding machine, and with an IC, the part moves into the CCD view field to get the image sample and felts the IC onto the LCD screen accurately. Because of the limited view field of CCD, blurry image is conduced by heat transmogrification when the part is heated. This paper introduces the finite element method （FEM） with ANSYS software to calculate the thermal-structnral deformation of the part, and the p,＇actieal measurement proves the finite element analysis, with which we could get the clearer image sample easily.

关 键 词：COG邦定机 ANSYS 热应变 有限元 

分 类 号：TP391.77[自动化与计算机技术—计算机应用技术]